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We offer an in-house service for thin film evaporation.  Our vacuum evaporation system consists of a vacuum chamber, mechanical and turbomolecular pumps, a high current low voltage circuit and an effusion cell.

The substrate (the material to coat) is held in place in the vacuum chamber by tooling of our own design. The chamber is then pumped down to UHV conditions. With the two pumps in tandem we routinely reach pressures as low as 1x10-7 mbar. A plasma is then generated by introducing a small amount of inert gas such as argon or nitrogen and applying a voltage. The ionized gas does a good job of releasing contaminants that cling to surfaces inside the chamber. Following this the coating material must be heated to evaporative temperatures by passing a current through the material. The evaporating metal then coats the substrate.

We offer a service to vacuum evaporate e.g. Al/Mg anodes used for x-ray photoelectron spectroscopy (XPS).

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