Deposition systems

Sputtering system [project 241]

Description

UHV magnetron sputtering system dedicated to accurate and reproducible thin film layer deposition. It is configured to allow sputtering from both magnetic and non-magnetic target materials alike.

Specification

The UHV system comprises a process chamber with ancillary equipment together with a load lock chamber. The process chamber base pressure is guaranteed better than <2*10-9 mbar. The overall design allows several source configurations, including tilt, and deposition over a large range of temperatures, up to 1000˚C. A unique feature of the system is that the source mounting stage on the bottom face of the chamber is designed so that it can be effortlessly exchanged. Software (PLC based) allows for complete freedom in creating programs. The user can define a sequence of steps carried out on any device registered in the system. In addition, sequences can be stacked in the program, where it is possible to call cyclical individual sequences and whole groups. The process editor allows many different types of operation on the sequences: copy, move (changing the order of calls), remove, steps edit etc..

  • The Deposition chamber is equipped with numerous ports for diagnostics and ancillary equipment. The five DN 100CF ports located on the bottom of the chamber are occupied by the magnetron sources which are suitable for DC sputtering, RF/pulsed DC sputtering or reactive DC sputtering for the deposition of both metallic and compound layers.
  • The load lock chamber includes an internal bakeout system.

 

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» Systems

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» Deposition system with door access [project 365]

 

UHV sputtering system dedicated to accurate and reproducible thin film layer deposition. It is configured to allow sputtering from two special design electron source.

 

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Multichamber UHV system [project 080]

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» Components

Flow Through High Pressure Reactor

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Designed to study reactions between gases and solid/powder samples under high pressure (beetwen reactor’s cups), in the reactor chamber under UHV conditions

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Ion Source IS 40C1

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Compact, easy-to-use extractor type ion gun for sample surface cleaning.

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1-4 axes PLD Target Manipulators

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Designed for target positioning in pulsed laser deposition applications.

 

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PTS FARA sample holder

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The PTS FARA sample holder has integrated Faraday Cup with secondary electron suppressor for beam profile measurements.

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» Electronics

Electron Source Power Supply ES40-PS

» Electron Source Power Supply ES40-PS

Allows fine adjustment of electron beam energy, density, position on the sample and also beam profile

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Ion Multi Gauge Controller MG13

» Ion Multi Gauge Controller MG13

Supports 2 vacuum gauges: one Bayard-Alpert gauge and any others existing gauge on the market based on 0÷10 V output standard.

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Bakeout Control Unit BCU14

» Bakeout Control Unit BCU14

Perfect unit dedicated for heating zones of the vacuum systems as well as heating samples inside the preparation chambers.

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Ion Source Power Supply IS40-PS

» Ion Source Power Supply IS40-PS

High stability & low noise power supply, which can be configured to work with IS40C1 or IS40E1 Ion Sources.

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» Software

Spectrium

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Control and data acquisition software dedicated to EA15 class analysers.

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Synthesium

» Synthesium

New software dedicated to vacuum deposition applications.

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Application for Thermal Desorption Spectroscopy

» Application for Thermal Desorption Spectroscopy

Used to control the power, preparing a recipe for heating and acquisition of measured data.

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