Deposition system with fully automated process control [project 458]
Deposition HV system dedicated for techniques: DC magnetron sputtering, RF magnetron sputtering, reactive sputtering and evaporation using electron beam.
- Sputtering chamber with base pressure range <3*10-7 mbar, made from stainless steel, with door access.
The chamber is equipped with two 3” magnetron sources (DC, RF) and 6-pocket electron beam evaporator.
- Electronic cabinets with integrated computer unit (with touchscreen) and dedicated software.
Software main features:
- Full control of deposition system
- Auto, manual and programmable timer for effective shutter control
- Graphical system state presentation
- Process creator and controller
- Fast, real time data preview
- real time data acquisition (integration with LIMS data acqusittion system)
- many others
Transferring system: sample holders up to 6"