Deposition systems

Deposition system with fully automated process control [project 458]

Deposition HV system dedicated for techniques: DC magnetron sputtering, RF magnetron sputtering, reactive sputtering and evaporation using electron beam.

System configuration:

  • Sputtering chamber with base pressure range <3*10-7 mbar, made from stainless steel, with door access.
    The chamber is equipped with two 3” magnetron sources (DC, RF) and 6-pocket electron beam evaporator.
  • Electronic cabinets with integrated computer unit (with touchscreen) and dedicated software.
    Software main features:
    - Full control of deposition system
    - Auto, manual and programmable timer for effective shutter control
    - Graphical system state presentation
    - Process creator and controller
    - Fast, real time data preview
    - real time data acquisition (integration with LIMS data acqusittion system)
    - many others

Transferring system: sample holders up to 6"

 

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