Deposition systems

HV Sputtering System
[project 518]

High-vacuum sputtering system for the deposition of non-magnetic metals and dielectrics, with capability to carry at least four sputtering sources. The loading and unloading process to and from the main chamber is performed using a load-lock in combination with a linear transfer mechanism. The substrate holder manipulator is capable of holding, continuous rotating, cooling and/or heating samples with size of up to 102 x 51 mm. A RF bias capability for cleaning and/or etching operations to the sample are included. All relevant pneumatic, electronic, electromagnetic and motorized coomponents are controllable by a central control unit, comprising a programmable logic controller in combination with human-machine-interface. Control software allows for full control over process recipes, and monitoring, manipulating all relevant subsystems.

 

  • Base pressure range 10-8 mbar,
  • Bottom flange with magnetron sputter sources can be fully accessible or replaced using dedicated lifting trolley,
  • Process chamber is equipped with quick door access,
  • Exchangeable shield inside process chamber, made of stainless-steal for easy cleaning,
  • 2-axes manipulator (Z= 50mm, R2 continuous rotation) with water cooling and automated motorized shutter,
  • RF plasma cleaning for substrate,
  • Two quartz crystal deposition thickness/rate monitor and control for co-sputtering calibration,
  • Load-Lock chamber with linear transfer mechanism for easy and fast substrate loading,
  • Water cooling option,
  • Process automation software.

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HV Sputtering System <br> [project 518]

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