Deposition systems

Magnetron Sputtering System in UHV standard [project 560]

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UHV system designed for confocal and planar „sputter down” RF/DC/DC PULS deposition process.

Fully automated transferring system for 3-inch substrate holders.
Process chamber designed for eight 2-inch magnetrin sources (confocal geometry) and one 4-inch source in center/planar geometry.
   Chamber is equipped with:
    - double sealed differentially pumped vacuum door for quick and easy access to process chamber
    - special trolley for mounting and dismounting bottom flange with manipulator
    - mechanism for lift-off the top flange with the magnetron sources
    - exchangeable shield for easy cleaning the chamber
Background pressure: <3x10^-8 mbar
Load lock/storage chamber for up to six 3 inch holders with easy-to-open lock door.
2-axes manipulator for substrate holder, with controllable temperature and pneumatic shutter.
Gas dosing system for oxidation

Control software Synthesium for full control over process recipes and monitoring, manipulating all relevant subsystems.

Related products

» Manipulators

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» Electronics

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» Components

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» Software

» Synthesium

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» Systems

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» MBE system [project 242]

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» PLD system [project 198]

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» UHV system for thin film evaporation [project 382]

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» Deposition system for plasma evaporation [project 383]

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