Instruments

Magnetron Source MS2 100 ISO-K

Magnetron Source MS2 100 ISO-K

Technical data

 

Mounting flange DN 100 ISO-K *
Max. power (DC mode) 400 W DC **
Max. power (RF mode) 400 W RF **
Max. voltage DC 1200 V
Connector DC/RF type 7/16
Target
    form
    diameter
    thickness
    cooling
 
circular
2" (50.8 mm) ± 0.2 mm
1 - 6 mm
indirect
Water flow min. 1l/min
Max. inlet water temperature  < 28 °C
Max. water pressure 3 bar
Tubing diameter Ø6×1 mm PTFE
Magnet material Neodymium Iron Boride (NdFeB)
Magnet max. temperature 200 °C
Internal pneumatic shutter yes - dome type shutter
Insitu tilt module no
Chimney yes
Typical rates
     Cu, 140 mm distance
     Ti, 140 mm distance

45 nm/min @ 300 W
30 nm/min @ 300 W 
 Internal gas inlet yes (VCR standard)
Working gas Ar
Max. working pressure 5×10-3 - 1×10-1 mbar
Optimal working pressure 5×10-3 - 5×10-2 mbar

* Other mounting flange on request.
** The maximum power is determined by the target material.

The MS2 100 ISO-K Magnetron Source is used to apply thin layers with high homogeneity in the sputtering process.

The source is compatible with UHV conditions. By using the dome type design we minimize the space needed to open the shutter. MS2 100 ISO-K is fully compatible with our M600DC-PS power supply as well as all other DC, RF and pulsed DC power supplies available on the market. Design without tilt module.

Features

  • Mounting flange: DN 100 ISO-K
  • Chimney as standard
  • Pneumatic dome type shutter

    Targets:
  • Diameter: 2"
  • Thickness | non-magnetic: 1-6 mm
  • Thickness | magnetic: Fe 1 mm, Co 2-3 mm, Ni 2 mm
  • Indirectly cooled

Options

  • Mass Flow Controller (MKS MF1)
  • Z manipulator

 

Download brochure with magnetron sputtering set: MS2 63C1 with power supply.

Check our multifunctional switch-mode DC power supply M600DC-PS, to drive up to 3 magnetron sources.

Magnetron Power Supply


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